Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components.
CLR1020 / CLH6021
- Cure Type: RT
Identify product options based on variables like Material Type, Cure Time, Mix Ratio,
Shore Hardness, and more.
Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components.
Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components.
Low viscosity, variable ratio, variable hardness. An unfilled, semi-flexible, two component, epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. For a more rigid system the mix ratio can be altered.
Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance.
Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance.
Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs.