Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance.
Identify product options based on variables like Material Type, Cure Time, Mix Ratio,
Shore Hardness, and more.
Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance.
Good thermal cycling, 2:1 mix by volume. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance.
Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance.
Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance.
Long pot life, Excellent heat dissipation. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required.
Excellent heat dissipation, 125°C Operating. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required.